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CAMBRIDGE, Mass. — HyperLight Corporation (“HyperLight”), a leader in thin-film lithium niobate (TFLN) photonics, today announced that VentureTech Alliance (“VTA”) has joined its Series C financing round. VTA is a venture investment firm focused on the semiconductor industry, with a portfolio built across the semiconductor technology stack — including circuit design, foundry-adjacent process technology, EDA, advanced packaging, and photonics.

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VTA’s participation extends the ecosystem alignment that defined the round, which brought together investors spanning silicon ICs, foundry manufacturing, electronics manufacturing services, networking, and global infrastructure capital. With VTA’s addition, the syndicate now reaches further into the semiconductor manufacturing and design-enablement layers on which high-volume photonics production depends.

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“The transition to TFLN is not a component decision — it is an ecosystem decision,” said Mian Zhang, CEO of HyperLight. “Getting TFLN into volume requires the process, the design rules, the models, and the qualification data to be in place so that partners across the chain can build on a common foundation. VTA understands how semiconductor platforms get established, and their participation reflects where TFLN now sits in the roadmap: not as an emerging material, but as a layer the industry is designing around.”

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HyperLight’s TFLN Chiplet™ Platform unifies the requirements of short-reach IMDD data center pluggables, longer-reach coherent datacom and telecom modules, and co-packaged optics (CPO) within a single high-volume manufacturable architecture. Products supporting 200G-per-lane operation are in production, with 400G-per-lane solutions now sampling.

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Increasingly, the platform is consumed not only as a device but as an integration-ready building block: HyperLight’s TFLN engines are designed to be adopted as IP blocks within partners’ advanced packaging and co-packaged optics flows, alongside the design rules, device models, and reliability data required to bring them into a customer’s own design environment. The company’s underlying portfolio of more than 150 patents spans TFLN device architecture, high-speed electrode design, and manufacturing process, and forms the technology foundation of the platform.

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“TFLN’s bandwidth and power efficiency make it a necessary layer for next-generation AI interconnect; HyperLight’s TFLN platform makes it the natural foundation for the ecosystem to build on,” said Kai Tsang, Managing Partner, VentureTech Alliance.

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HyperLight delivers high-performance integrated photonics solutions based on thin-film lithium niobate technology. The company combines the electro-optic advantages of TFLN with scalable manufacturing, test, and integration to enable next-generation optical engines for AI data centers, telecom and metro networks, and emerging photonics markets.

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